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Title: Microchannel cooling of face down bonded chips

Abstract

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Inventors:
 [1]
  1. Berkeley, CA
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
868813
Patent Number(s):
US 5218515
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
microchannel; cooling; bonded; chips; applied; flip-chip; integrated; circuits; manner; maintains; advantages; bonds; overcoming; difficulties; encountered; technique; suited; multichip; circuit; boards; plane; stacks; dimensional; interconnect; structure; mounted; board; control; collapse; essentially; permanently; coupled; chip; coolant; delivery; manifold; delivers; seal; consisting; compressible; elastomer; provided; connected; form; replaceable; module; easily; decoupled; supply; manifolds; disposed; stack; supplies; circuit board; integrated circuits; integrated circuit; circuit boards; circuit chip; channel structure; interconnect structure; supply manifold; circuit chips; microchannel cooling; chip bond; /361/257/

Citation Formats

Bernhardt, Anthony F. Microchannel cooling of face down bonded chips. United States: N. p., 1993. Web.
Bernhardt, Anthony F. Microchannel cooling of face down bonded chips. United States.
Bernhardt, Anthony F. Fri . "Microchannel cooling of face down bonded chips". United States. https://www.osti.gov/servlets/purl/868813.
@article{osti_868813,
title = {Microchannel cooling of face down bonded chips},
author = {Bernhardt, Anthony F},
abstractNote = {Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {1}
}

Patent:

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