Direct write with microelectronic circuit fabrication
- Ann Arbor, MI
- Albuquerque, NM
In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.
- Research Organization:
- AT&T
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Number(s):
- US 5132248
- OSTI ID:
- 868399
- Country of Publication:
- United States
- Language:
- English
Patterned aluminum growth via excimer laser activated metalorganic chemical vapor deposition
|
journal | April 1986 |
Recent Advances in Laser-Enhanced Plating
|
journal | January 1983 |
Laser-Enhanced Plating and Etching: Mechanisms and Applications
|
journal | March 1982 |
Laser‐initiated deposition reactions: Microchemistry in organogold polymer films
|
journal | November 1985 |
Laser chemical vapor deposition of gold
|
journal | September 1985 |
High speed precision X-Y stage
|
journal | January 1985 |
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Related Subjects
write
microelectronic
circuit
fabrication
process
deposition
material
substrate
example
metals
dielectrics
semiconductor
laser
deposited
providing
colloidal
suspension
directly
writing
surface
jet
printing
techniques
procedure
minimizes
handling
requirements
exchange
energy
interface
resolved
desired
pattern
preferably
subjecting
deposit
annealing
step
provides
resolution
resultant
minimizing
overall
thermal
load
permitting
precise
control
chemistry
interdiffusion
circuit fabrication
precise control
laser annealing
semiconductor laser
electronic circuit
substrate surface
deposition process
deposited material
colloidal suspension
annealing step
desired pattern
overall thermal
thermal load
microelectronic circuit
printing techniques
direct write
/505/347/427/438/