Controlled growth of semiconductor crystals
- Richmond, CA
A method for growth of III-V, II-VI and related semiconductor single crystals that suppresses random nucleation and sticking of the semiconductor melt at the crucible walls. Small pieces of an oxide of boron B.sub.x O.sub.y are dispersed throughout the comminuted solid semiconductor charge in the crucible, with the oxide of boron preferably having water content of at least 600 ppm. The crucible temperature is first raised to a temperature greater than the melt temperature T.sub.m1 of the oxide of boron (T.sub.m1 =723.degree. K. for boron oxide B.sub.2 O.sub.3), and the oxide of boron is allowed to melt and form a reasonably uniform liquid layer between the crucible walls and bottom surfaces and the still-solid semiconductor charge. The temperature is then raised to approximately the melt temperature T.sub.m2 of the semiconductor charge material, and crystal growth proceeds by a liquid encapsulated, vertical gradient freeze process. About half of the crystals grown have a dislocation density of less than 1000/cm.sup.2. If the oxide of boron has water content less than 600 ppm, the crucible material should include boron nitride, a layer of the inner surface of the crucible should be oxidized before the oxide of boron in the crucible charge is melted, and the sum of thicknesses of the solid boron oxide layer and liquid boron oxide layer should be at least 50 .mu.m.
- Research Organization:
- Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA
- DOE Contract Number:
- AC03-76SF00098
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5131975
- OSTI ID:
- 868396
- Country of Publication:
- United States
- Language:
- English
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1000
50
600
723
allowed
approximately
boron
boron nitride
boron oxide
bottom
bottom surface
bottom surfaces
charge
charge material
cm
comminuted
content
controlled
crucible
crystal
crystal growth
crystals
crystals grown
degree
density
dislocation
dislocation density
dispersed
dispersed throughout
encapsulated
form
freeze
gradient
grown
growth
half
ii-vi
iii-v
inner
inner surface
layer
liquid
liquid layer
m1
m2
material
melt
melt temperature
melted
method
nitride
nucleation
oxide
oxide layer
oxidized
pieces
ppm
preferably
proceeds
process
raised
random
reasonably
related
semiconductor
semiconductor charge
semiconductor crystal
semiconductor single
single
single crystal
single crystals
solid
solid boron
solid semiconductor
sticking
still-solid
suppresses
surface
surfaces
temperature
thicknesses
throughout
uniform
vertical
walls
water
water content