Solder extrusion pressure bonding process and bonded products produced thereby

Patent · Wed Jan 01 00:00:00 EST 1992

OSTI ID:868343

Beavis, Leonard C ^[1]; Karnowsky, Maurice M ^[1]; Yost, Frederick G ^[2]

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1. Albuquerque, NM
2. Ceder Crest, NM

Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

• Research Organization: AT&T
• DOE Contract Number: AC04-76DP00789
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 5121871
• OSTI ID: 868343
• Country of Publication: United States
• Language: English

Related Subjects

solder
extrusion
pressure
bonding
process
bonded
products
produced
production
soldered
joints
highly
reliable
capable
surviving
10
000
thermal
cycles
-40
degree
110
involves
interposing
layer
metal
composition
surfaces
applying
heat
1000
psi
compression
superposed
presence
reducing
atmosphere
extrude
major
amount
contaminants
including
fluxing
gases
air
form
strong
intermetallic
expansion
tolerant
bonding process
major amount
reducing atmosphere
metal surface
process involves
metal surfaces
thermal expansion
products produced
thermal cycle
metallic bond
bonding layer
applying heat
highly reliable
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