Chemical deposition methods using supercritical fluid solutions

Patent · 01 January 1990

OSTI ID:867603

Sievers, Robert E ^[1]; Hansen, Brian N ^[1]

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1. Boulder, CO

A method for depositing a film of a desired material on a substrate comprises dissolving at least one reagent in a supercritical fluid comprising at least one solvent. Either the reagent is capable of reacting with or is a precursor of a compound capable of reacting with the solvent to form the desired product, or at least one additional reagent is included in the supercritical solution and is capable of reacting with or is a precursor of a compound capable of reacting with the first reagent or with a compound derived from the first reagent to form the desired material. The supercritical solution is expanded to produce a vapor or aerosol and a chemical reaction is induced in the vapor or aerosol so that a film of the desired material resulting from the chemical reaction is deposited on the substrate surface. In an alternate embodiment, the supercritical solution containing at least one reagent is expanded to produce a vapor or aerosol which is then mixed with a gas containing at least one additional reagent. A chemical reaction is induced in the resulting mixture so that a film of the desired material is deposited.

• Research Organization: SIEVERS RESEARCH INC
• DOE Contract Number: AC05-88ER80684
• Assignee: University of Colorado Foundation (Boulder, CO)
• Patent Number(s): US 4970093
• OSTI ID: 867603
• Country of Publication: United States
• Language: English

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