(110) Oriented silicon wafer latch accelerometer and process for forming the same

Title: (110) Oriented silicon wafer latch accelerometer and process for forming the same

Full Record
Other Related Research

Abstract

A method for etching a (110) silicon wafer to produce latching cantilever beams, which bend parallel to the surface of the wafer. The resulting apparatus is also part of the invention.

Inventors:

Ciarlo, Dino R ^[1]

Livermore, CA

Publication Date:: 1990-01-01

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

OSTI Identifier:: 867230

Patent Number(s):: US 4891255

Assignee:: United States of America as represented by United States (Washington, DC)

DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 110; oriented; silicon; wafer; latch; accelerometer; process; forming; method; etching; produce; latching; cantilever; beams; bend; parallel; surface; resulting; apparatus; silicon wafer; /428/73/216/

Citation Formats


                    Ciarlo, Dino R. (110) Oriented silicon wafer latch accelerometer and process for forming the same.  United States: N. p., 1990. 
        Web.

Copy to clipboard


                    Ciarlo, Dino R. (110) Oriented silicon wafer latch accelerometer and process for forming the same.  United States.

Copy to clipboard


                    Ciarlo, Dino R. Mon .  
        "(110) Oriented silicon wafer latch accelerometer and process for forming the same".  United States.  https://www.osti.gov/servlets/purl/867230.

Copy to clipboard


                    
@article{osti_867230,

  title        = {(110) Oriented silicon wafer latch accelerometer and process for forming the same},

  author       = {Ciarlo, Dino R},

  abstractNote = {A method for etching a (110) silicon wafer to produce latching cantilever beams, which bend parallel to the surface of the wafer. The resulting apparatus is also part of the invention.},

  doi          = {},

  url          = {https://www.osti.gov/biblio/867230},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1990},

  month        = {1}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Similar records in OSTI.GOV collections:

Oriented silicon wafer latch accelerometer (110)

Patent Application Ciarlo, D R

A method for etching a (110) silicon wafer to produce latching cantilever beams, which bend parallel to the surface of the wafer. The resulting apparatus is also part of the invention. 6 figs.
(110) Oriented silicon wafer latch accelerometer process for forming the same

Patent Ciarlo, D R

This patent describes an apparatus. It comprises: a (110) silicon wafer with a thickness, comprising: a frame; a first cantilever beam, with a first end attached to the frame and a second end, which is a free end which is not attached to the frame, and with a length dimension from the first end to the second end, and a thickness, wherein the length and the thickness are substantially parallel to the (110) plane, and a width substantially perpendicular to the (110) plane and substantially equal to the thickness of the wafer; a second cantilever beam, with a first endmore »« less
Silicon microscale mechanisms from (110) oriented wafers

Technical Report Ciarlo, D R

We have studied the use of (110) oriented silicon wafers for the fabrication of cantilever type accelerometers. Using this orientation, canilevers can be fabricated such that their thickness is in a direction parallel to the wafer surface, and their width is equal to the wafer thickness. With such a design, the cantilevers deflect in a direction parallel to the wafer surface instead of perpendicular to the surface, as is the case with cantilevers fabricated from (100) oriented wafers. It might be possible to fabricate structures such as setback accelerometers and latching mechanisms with (110) silicon cantilevers. We have designed andmore »« less
Corner compensation structures for (110) oriented silicon

Conference Ciarlo, D R

We have studied the use of (110) oriented silicon wafers for the fabrication of microscale mechanisms such as cantilever beams and latching mechanisms. Using this orientation, cantilever beams can be fabricated such that they deflect in a parallel direction to the wafer surface. It might be possible to fabricate structures such as setback accelerometers and latching mechanisms with (110) silicon cantilevers. We have designed and fabricated corner compensation structures for use with (110) oriented cantilever beams. 6 refs., 4 figs.
Method for making circular tubular channels with two silicon wafers

Patent Yu, C M ; Hui, W C

A two-wafer microcapillary structure is fabricated by depositing boron nitride (BN) or silicon nitride (Si{sub 3}N{sub 4}) on two separate silicon wafers (e.g., crystal-plane silicon with [100] or [110] crystal orientation). Photolithography is used with a photoresist to create exposed areas in the deposition for plasma etching. A slit entry through to the silicon is created along the path desired for the ultimate microcapillary. Acetone is used to remove the photoresist. An isotropic etch, e.g., such as HF/HNO{sub 3}/CH{sub 3}COOH, then erodes away the silicon through the trench opening in the deposition layer. A channel with a half-circular cross sectionmore »« less

Similar Records