Multi-lead heat sink

Patent · Sun Jan 01 00:00:00 EST 1984

OSTI ID:865068

Roose, Lars D ^[1]

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1. Albuquerque, NM

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

• Research Organization: Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
• DOE Contract Number: W-7405-ENG-36
• Assignee: Regents of University of California (Berkeley, CA)
• Patent Number(s): US 4457360
• OSTI ID: 865068
• Country of Publication: United States
• Language: English

Related Subjects

multi-lead
heat
sink
disclosure
relates
protect
integrated
circuits
resulting
soldering
circuit
boards
tubular
housing
contains
slidable
engages
somewhat
inwardly
extending
connecting
rods
rotatably
attached
bottom
rod
fastened
expandable
coil
spring
loop
pushed
downward
edge
forces
outward
expanding
fit
device
slid
upward
contracts
leads
conducted
absorbs
excess
therefrom
placement
steps
repeated
reverse
remove
inwardly extending
connecting rod
connecting rods
tubular housing
circuit board
heat sink
disclosure relates
integrated circuits
integrated circuit
heat resulting
excess heat
circuit boards
coil spring
rotatably attached
housing contains
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