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Title: Dual circuit embossed sheet heat transfer panel

Abstract

A heat transfer panel provides redundant cooling for fusion reactors or the like environment requiring low-mass construction. Redundant cooling is provided by two independent cooling circuits, each circuit consisting of a series of channels joined to inlet and outlet headers. The panel comprises a welded joinder of two full-size and two much smaller partial-size sheets. The first full-size sheet is embossed to form first portions of channels for the first and second circuits, as well as a header for the first circuit. The second full-sized sheet is then laid over and welded to the first full-size sheet. The first and second partial-size sheets are then overlaid on separate portions of the second full-sized sheet, and are welded thereto. The first and second partial-sized sheets are embossed to form inlet and outlet headers, which communicate with channels of the second circuit through apertures formed in the second full-sized sheet.

Inventors:
 [1]
  1. (St. Louis County, MO)
Publication Date:
Research Org.:
Argonne National Laboratory (ANL), Argonne, IL
OSTI Identifier:
864892
Patent Number(s):
US 4432414
Assignee:
United States of America are represented by United States (Washington, DC) ANL
DOE Contract Number:  
W-31109-ENG-38
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
dual; circuit; embossed; sheet; heat; transfer; panel; provides; redundant; cooling; fusion; reactors; environment; requiring; low-mass; construction; provided; independent; circuits; consisting; series; channels; joined; inlet; outlet; headers; comprises; welded; joinder; full-size; partial-size; sheets; form; portions; header; full-sized; laid; overlaid; separate; thereto; partial-sized; communicate; apertures; formed; fusion reactors; heat transfer; fusion reactor; cooling circuit; redundant cooling; panel comprises; panel provides; transfer panel; dual circuit; /165/376/

Citation Formats

Morgan, Grover D. Dual circuit embossed sheet heat transfer panel. United States: N. p., 1984. Web.
Morgan, Grover D. Dual circuit embossed sheet heat transfer panel. United States.
Morgan, Grover D. Sun . "Dual circuit embossed sheet heat transfer panel". United States. https://www.osti.gov/servlets/purl/864892.
@article{osti_864892,
title = {Dual circuit embossed sheet heat transfer panel},
author = {Morgan, Grover D.},
abstractNote = {A heat transfer panel provides redundant cooling for fusion reactors or the like environment requiring low-mass construction. Redundant cooling is provided by two independent cooling circuits, each circuit consisting of a series of channels joined to inlet and outlet headers. The panel comprises a welded joinder of two full-size and two much smaller partial-size sheets. The first full-size sheet is embossed to form first portions of channels for the first and second circuits, as well as a header for the first circuit. The second full-sized sheet is then laid over and welded to the first full-size sheet. The first and second partial-size sheets are then overlaid on separate portions of the second full-sized sheet, and are welded thereto. The first and second partial-sized sheets are embossed to form inlet and outlet headers, which communicate with channels of the second circuit through apertures formed in the second full-sized sheet.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1984},
month = {Sun Jan 01 00:00:00 EST 1984}
}

Patent:

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