Multiwire conductor having greatly increased interwire resistance and method for making same

Patent · 17 January 1984

OSTI ID:864842

Luhman, Thomas ^[1]; Suenaga, Masaki ^[2]

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1. Seattle, WA
2. Bellport, NY

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

• Research Organization: ASSOC UNIVERSITIES INC
• DOE Contract Number: AC02-76CH00016
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4426550
• Application Number: 06/358,085
• OSTI ID: 864842
• Country of Publication: United States
• Language: English

Related Subjects

/174/29/156/228/335/423/505/
adapted
allow
amount
based
braided
brittle
brittle intermetallic
causing
compound
comprising
conductor
cooling
copper
cracking
cu
dissolved
filled
filled conductor
filler
flexed
forms
greatly
greatly increase
greatly increased
heated
improved
improved multiwire
increased
increased interwire
increasing
intermetallic
intermetallic compound
interwire
interwire resistance
mechanically
mechanically stabilized
melting
metallic compound
method
multiwire
multiwire conductor
particularly
particularly adapted
period
random
resistance
ribbon-type
solder
solder filled
solder filler
stabilized
subject
substantial
substantial amount
superconductors
temperature
type
wires