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Title: Method for conducting electroless metal-plating processes

Abstract

This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

Inventors:
 [1];  [1]
  1. (Oak Ridge, TN)
Publication Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN
OSTI Identifier:
863222
Patent Number(s):
US 4125642
Assignee:
United States of America as represented by United States (Washington, DC) ORNL
DOE Contract Number:  
W-7405-ENG-26
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; conducting; electroless; metal-plating; processes; improved; metal; tank; exposed; plating; bath; solves; commonly; encountered; determine; advisable; shutdown; process; clean; re-passivate; comprises; contacting; current-conducting; non-catalytic; probe; operations; monitoring; gradually; changing; difference; electropotential; found; value; voltage; indicative; extent; nickel-bearing; decomposition; products; accumulate; utilizing; cleaning; operator; avoid; premature; time; prolonging; spontaneous; occurs; decomposition products; comprises contacting; method comprises; improved method; plating bath; method comprise; commonly encountered; electroless metal; metal-plating processes; electroless metal-plating; plating process; conducting electroless; /427/134/204/

Citation Formats

Petit, George S., and Wright, Ralph R. Method for conducting electroless metal-plating processes. United States: N. p., 1978. Web.
Petit, George S., & Wright, Ralph R. Method for conducting electroless metal-plating processes. United States.
Petit, George S., and Wright, Ralph R. Sun . "Method for conducting electroless metal-plating processes". United States. https://www.osti.gov/servlets/purl/863222.
@article{osti_863222,
title = {Method for conducting electroless metal-plating processes},
author = {Petit, George S. and Wright, Ralph R.},
abstractNote = {This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1978},
month = {1}
}

Patent:

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