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Title: ULTRA-HIGH TEMPERATURE SENSORS BASED ON OPTICAL PROPERTY MODULATION AND VIBRATION-TOLERANT INTERFEROMETRY

Abstract

The goals of the first six months of this project were to lay the foundations for both the SiC front-end optical chip fabrication as well as the free-space laser beam interferometer designs and preliminary tests. In addition, a Phase I goal was to design and experimentally build the high temperature and pressure infrastructure and test systems that will be used in the next 6 months for proposed sensor experimentation and data processing. All these goals have been achieved and are described in detail in the report. Both design process and diagrams for the mechanical elements as well as the optical systems are provided. In addition, photographs of the fabricated SiC optical chips, the high temperature & pressure test chamber instrument, the optical interferometer, the SiC sample chip holder, and signal processing data are provided. The design and experimentation results are summarized to give positive conclusions on the proposed novel high temperature optical sensor technology. The goals of the second six months of this project were to conduct high temperature sensing tests using the test chamber and optical sensing instrument designs developed in the first part of the project. In addition, a Phase I goal was to develop the basic processingmore » theory and physics for the proposed first sensor experimentation and data processing. All these goals have been achieved and are described in detail. Both optical experimental design process and sensed temperature are provided. In addition, photographs of the fabricated SiC optical chips after deployment in the high temperature test chamber are shown from a material study point-of-view.« less

Authors:
Publication Date:
Research Org.:
Nuonics, Inc. (US)
Sponsoring Org.:
(US)
OSTI Identifier:
835509
DOE Contract Number:  
FC26-03NT41923
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: 10 Nov 2004
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION; 36 MATERIALS SCIENCE; FABRICATION; INTERFEROMETRY; MODULATION; OPTICAL SYSTEMS; TEMPERATURE MEASUREMENT; DESIGN; SILICON CARBIDES

Citation Formats

Nabeel A. Riza. ULTRA-HIGH TEMPERATURE SENSORS BASED ON OPTICAL PROPERTY MODULATION AND VIBRATION-TOLERANT INTERFEROMETRY. United States: N. p., 2004. Web. doi:10.2172/835509.
Nabeel A. Riza. ULTRA-HIGH TEMPERATURE SENSORS BASED ON OPTICAL PROPERTY MODULATION AND VIBRATION-TOLERANT INTERFEROMETRY. United States. doi:10.2172/835509.
Nabeel A. Riza. Wed . "ULTRA-HIGH TEMPERATURE SENSORS BASED ON OPTICAL PROPERTY MODULATION AND VIBRATION-TOLERANT INTERFEROMETRY". United States. doi:10.2172/835509. https://www.osti.gov/servlets/purl/835509.
@article{osti_835509,
title = {ULTRA-HIGH TEMPERATURE SENSORS BASED ON OPTICAL PROPERTY MODULATION AND VIBRATION-TOLERANT INTERFEROMETRY},
author = {Nabeel A. Riza},
abstractNote = {The goals of the first six months of this project were to lay the foundations for both the SiC front-end optical chip fabrication as well as the free-space laser beam interferometer designs and preliminary tests. In addition, a Phase I goal was to design and experimentally build the high temperature and pressure infrastructure and test systems that will be used in the next 6 months for proposed sensor experimentation and data processing. All these goals have been achieved and are described in detail in the report. Both design process and diagrams for the mechanical elements as well as the optical systems are provided. In addition, photographs of the fabricated SiC optical chips, the high temperature & pressure test chamber instrument, the optical interferometer, the SiC sample chip holder, and signal processing data are provided. The design and experimentation results are summarized to give positive conclusions on the proposed novel high temperature optical sensor technology. The goals of the second six months of this project were to conduct high temperature sensing tests using the test chamber and optical sensing instrument designs developed in the first part of the project. In addition, a Phase I goal was to develop the basic processing theory and physics for the proposed first sensor experimentation and data processing. All these goals have been achieved and are described in detail. Both optical experimental design process and sensed temperature are provided. In addition, photographs of the fabricated SiC optical chips after deployment in the high temperature test chamber are shown from a material study point-of-view.},
doi = {10.2172/835509},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Nov 10 00:00:00 EST 2004},
month = {Wed Nov 10 00:00:00 EST 2004}
}

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