Recombination Parameters in InGaAsSb Epitaxial Layers for Thermophotovoltaic Applications
Radio-frequency (RF) photoreflectance measurements and one-dimensional device simulations have been used to evaluate bulk recombination parameter and surface recombination velocity (SRV) in doubly-capped 0.55 eV, 2 x 10{sup 17} cm{sup -3} doped p-InGaAsSb epitaxial layers for thermophotovoltaic (TPV) applications. Bulk lifetimes of 90-100 ns and SRVs of 680 cm/s to 3200 cm/s (depending on the capping layer) are obtained, with higher doping and higher bandgap capping layers most effective in reducing SRV. RF photoreflectance measurements and one-dimensional device simulations are compatible with a radiative recombination coefficient (B) of 3 x 10{sup -11} cm{sup 3}/s and Auger coefficient (C) of 1 x 10{sup -28} cm{sup 6}/s.
- Research Organization:
- Lockheed Martin Corporation, Schenectady, NY 12301 (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC12-00SN39357
- OSTI ID:
- 821373
- Report Number(s):
- LM-03K035; TRN: US200411%%37
- Resource Relation:
- Other Information: PBD: 17 Mar 2003
- Country of Publication:
- United States
- Language:
- English
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