Development of high data readout rate pixel module and detector hybridization at Fermilab
Conference
·
· Nucl.Instrum.Meth.A
- Fermilab; Puebla U., Mexico
This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.
- Research Organization:
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), High Energy Physics (HEP)
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 776027
- Report Number(s):
- FERMILAB-CONF-00-348; oai:inspirehep.net:554495; TRN: US0101353
- Journal Information:
- Nucl.Instrum.Meth.A, Vol. 465; Other Information: PBD: 20 Mar 2001
- Country of Publication:
- United States
- Language:
- English
Proposal for an Experiment to Measure Mixing, CP Violation and Rare Decays in Charm and Beauty Particle Decays at the Fermilab Collider - BTeV | report | May 2000 |
Modeling and simulation of a readout architecture for pixel detectors
|
journal | December 2000 |
Readout architecture of the CMS pixel detector
|
journal | June 2001 |
Development of a pixel readout chip for BTeV
|
journal | October 1999 |
Fluxless no-clean assembly of solder bumped flip chips
|
conference | May 1996 |
Similar Records
Pixel multichip module development at Fermilab
Study of indium and solder bumps for the BTeV Pixel Detector
Radiation tolerance of prototype BTeV pixel detector readout chips
Journal Article
·
Sat Oct 01 00:00:00 EDT 2005
·
OSTI ID:776027
+5 more
Study of indium and solder bumps for the BTeV Pixel Detector
Conference
·
Wed Nov 05 00:00:00 EST 2003
·
OSTI ID:776027
Radiation tolerance of prototype BTeV pixel detector readout chips
Conference
·
Fri Jul 12 00:00:00 EDT 2002
·
OSTI ID:776027