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Title: Development of high data readout rate pixel module and detector hybridization at Fermilab

Conference · · Nucl.Instrum.Meth.A

This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.

Research Organization:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), High Energy Physics (HEP)
DOE Contract Number:
AC02-07CH11359
OSTI ID:
776027
Report Number(s):
FERMILAB-CONF-00-348; oai:inspirehep.net:554495; TRN: US0101353
Journal Information:
Nucl.Instrum.Meth.A, Vol. 465; Other Information: PBD: 20 Mar 2001
Country of Publication:
United States
Language:
English

References (5)

Proposal for an Experiment to Measure Mixing, CP Violation and Rare Decays in Charm and Beauty Particle Decays at the Fermilab Collider - BTeV report May 2000
Modeling and simulation of a readout architecture for pixel detectors journal December 2000
Readout architecture of the CMS pixel detector journal June 2001
Development of a pixel readout chip for BTeV
  • Christian, D. C.; Appel, J. A.; Cancelo, G.
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 435, Issue 1-2 https://doi.org/10.1016/S0168-9002(99)00421-0
journal October 1999
Fluxless no-clean assembly of solder bumped flip chips conference May 1996