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Title: Development of high data readout rate pixel module and detector hybridization at Fermilab

Abstract

This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.

Authors:
Publication Date:
Research Org.:
Fermi National Accelerator Lab., Batavia, IL (US)
Sponsoring Org.:
USDOE Office of Energy Research (ER) (US)
OSTI Identifier:
776027
Report Number(s):
FERMILAB-Conf-00/348
TRN: US0101353
DOE Contract Number:  
AC02-76CH03000
Resource Type:
Conference
Resource Relation:
Conference: Pixel 2000, Int. Workshop on Semiconductor Pixel Det. for Particles and X-Rays, Genova (IT), 06/05/2000--06/08/2000; Other Information: PBD: 20 Mar 2001
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; 43 PARTICLE ACCELERATORS; DATA TRANSMISSION SYSTEMS; DESIGN; FABRICATION; FERMILAB; INDIUM; PERFORMANCE; RADIATION DETECTORS

Citation Formats

Sergio Zimmermann et al. Development of high data readout rate pixel module and detector hybridization at Fermilab. United States: N. p., 2001. Web.
Sergio Zimmermann et al. Development of high data readout rate pixel module and detector hybridization at Fermilab. United States.
Sergio Zimmermann et al. Tue . "Development of high data readout rate pixel module and detector hybridization at Fermilab". United States. https://www.osti.gov/servlets/purl/776027.
@article{osti_776027,
title = {Development of high data readout rate pixel module and detector hybridization at Fermilab},
author = {Sergio Zimmermann et al.},
abstractNote = {This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 20 00:00:00 EST 2001},
month = {Tue Mar 20 00:00:00 EST 2001}
}

Conference:
Other availability
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