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Title: P-type doping of GaN

Abstract

After implantation of As, As + Be, and As + Ga into GaN and annealing for short durations at temperatures as high as 1500 C, the GaN films remained highly resistive. It was apparent from c-RBS studies that although implantation damage did not create an amorphous layer in the GaN film, annealing at 1500 C did not provide enough energy to completely recover the radiation damage. Disorder recovered significantly after annealing at temperatures up to 1500 C, but not completely. From SIMS analysis, oxygen contamination in the AIN capping layer causes oxygen diffusion into the GaN film above 1400 C. The sapphire substrate (A1203) also decomposed and oxygen penetrated into the backside of the GaN layer above 1400 C. To prevent donor-like oxygen impurities from the capping layer and the substrate from contaminating the GaN film and compensating acceptors, post-implantation annealing should be done at temperatures below 1500 C. Oxygen in the cap could be reduced by growing the AIN cap on the GaN layer after the GaN growth run or by depositing the AIN layer in a ultra high vacuum (UHV) system post-growth to minimize residual oxygen and water contamination. With longer annealing times at 1400 C or atmore » higher temperatures with a higher quality AIN, the implantation drainage may fully recover.« less

Authors:
 [1]
  1. Univ. of California, Berkeley, CA (United States)
Publication Date:
Research Org.:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
764386
Report Number(s):
LBNL-45553
R&D Project: 513310; TRN: US0100055
DOE Contract Number:  
AC03-76SF00098
Resource Type:
Thesis/Dissertation
Resource Relation:
Other Information: TH: Thesis (M.S.); Submitted to University of California, Berkeley, CA 94720 (US); PBD: 10 Apr 2000
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ANNEALING; DIFFUSION; IMPURITIES; OXYGEN; SAPPHIRE; SUBSTRATES; GALLIUM NITRIDES; DOPED MATERIALS; ION IMPLANTATION; ARSENIC; BERYLLIUM; GALLIUM; ALUMINIUM NITRIDES; P-TYPE CONDUCTORS

Citation Formats

Wong, Raechelle Kimberly. P-type doping of GaN. United States: N. p., 2000. Web. doi:10.2172/764386.
Wong, Raechelle Kimberly. P-type doping of GaN. United States. doi:10.2172/764386.
Wong, Raechelle Kimberly. Sat . "P-type doping of GaN". United States. doi:10.2172/764386. https://www.osti.gov/servlets/purl/764386.
@article{osti_764386,
title = {P-type doping of GaN},
author = {Wong, Raechelle Kimberly},
abstractNote = {After implantation of As, As + Be, and As + Ga into GaN and annealing for short durations at temperatures as high as 1500 C, the GaN films remained highly resistive. It was apparent from c-RBS studies that although implantation damage did not create an amorphous layer in the GaN film, annealing at 1500 C did not provide enough energy to completely recover the radiation damage. Disorder recovered significantly after annealing at temperatures up to 1500 C, but not completely. From SIMS analysis, oxygen contamination in the AIN capping layer causes oxygen diffusion into the GaN film above 1400 C. The sapphire substrate (A1203) also decomposed and oxygen penetrated into the backside of the GaN layer above 1400 C. To prevent donor-like oxygen impurities from the capping layer and the substrate from contaminating the GaN film and compensating acceptors, post-implantation annealing should be done at temperatures below 1500 C. Oxygen in the cap could be reduced by growing the AIN cap on the GaN layer after the GaN growth run or by depositing the AIN layer in a ultra high vacuum (UHV) system post-growth to minimize residual oxygen and water contamination. With longer annealing times at 1400 C or at higher temperatures with a higher quality AIN, the implantation drainage may fully recover.},
doi = {10.2172/764386},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {4}
}

Thesis/Dissertation:
Other availability
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