skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Ultrasonic evaluation of beryllium-copper diffusion bonds

Abstract

A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths.

Authors:
Publication Date:
Research Org.:
Kansas City Plant, Kansas City, MO (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
756292
Report Number(s):
KCP-613-6332
TRN: AH200019%%121
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: 8 Jun 2000
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BERYLLIUM; COPPER; BONDING; JOINTS; ULTRASONIC TESTING; DIAGNOSTIC TECHNIQUES; PERFORMANCE TESTING; ADHESION

Citation Formats

Jamieson, E.E. Ultrasonic evaluation of beryllium-copper diffusion bonds. United States: N. p., 2000. Web. doi:10.2172/756292.
Jamieson, E.E. Ultrasonic evaluation of beryllium-copper diffusion bonds. United States. doi:10.2172/756292.
Jamieson, E.E. Thu . "Ultrasonic evaluation of beryllium-copper diffusion bonds". United States. doi:10.2172/756292. https://www.osti.gov/servlets/purl/756292.
@article{osti_756292,
title = {Ultrasonic evaluation of beryllium-copper diffusion bonds},
author = {Jamieson, E.E.},
abstractNote = {A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths.},
doi = {10.2172/756292},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {6}
}