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Title: A new active solder for joining electronic components

Abstract

Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

Authors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
756107
Report Number(s):
SAND2000-1191C
TRN: AH200021%%127
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: International Brazing and Soldering Conference, Albuquerque, NM (US), 04/02/2000--04/05/2000; Other Information: PBD: 11 May 2000
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MICROELECTRONICS; SOLDERING; METALLURGICAL FLUX; SOLDERED JOINTS; MICROSTRUCTURE; COPPER; ALUMINIUM; ALUMINIUM OXIDES; ALUMINIUM NITRIDES; SILICON

Citation Formats

SMITH,RONALD W., VIANCO,PAUL T., HERNANDEZ,CYNTHIA L., LUGSCHEIDER,E., RASS,I., and HILLEN,F. A new active solder for joining electronic components. United States: N. p., 2000. Web.
SMITH,RONALD W., VIANCO,PAUL T., HERNANDEZ,CYNTHIA L., LUGSCHEIDER,E., RASS,I., & HILLEN,F. A new active solder for joining electronic components. United States.
SMITH,RONALD W., VIANCO,PAUL T., HERNANDEZ,CYNTHIA L., LUGSCHEIDER,E., RASS,I., and HILLEN,F. Thu . "A new active solder for joining electronic components". United States. https://www.osti.gov/servlets/purl/756107.
@article{osti_756107,
title = {A new active solder for joining electronic components},
author = {SMITH,RONALD W. and VIANCO,PAUL T. and HERNANDEZ,CYNTHIA L. and LUGSCHEIDER,E. and RASS,I. and HILLEN,F.},
abstractNote = {Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {5}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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