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Title: Integration of optoelectronics and MEMS by free-space micro-optics

Abstract

This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shattering of optical sources. The two technologies use dissimilar materials with significant compatibility problems for a common process line. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and through-vias in the substrate. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light. The authors explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. The components can be surface-mounted by flip-chip bonding to the substrate. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate frommore » one device to another and them be directed out of the substrate into free space. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. They report progress on a MEMS-based laser scanner using these concepts.« less

Authors:
; ; ; ; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
756048
Report Number(s):
SAND2000-1337
TRN: AH200020%%59
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: 1 Jun 2000
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MICROELECTRONICS; MACHINERY; DISCRIMINATORS; SHUTTERS; OPTICAL SYSTEMS; MICROELECTROMECHANICAL SYSTEMS; MEMS; MICRO-OPTOELECTROMECHANICAL SYSTEMS; MOEMS; OPTOELECTRONICS; OPTICAL INTEGRATION; MICROSYSTEM; DEEP REACTIVE ION ETCHING; VCSEL; HYBRID PACKAGE; DIFFRACTIVE OPTICAL ELEMENT

Citation Formats

WARREN,MIAL E., SPAHN,OLGA B., SWEATT,WILLIAM C., SHUL,RANDY J., WENDT,JOEL R., VAWTER,GREGORY A., KRYGOWSKI,TOM W., REYES,DAVID NMN, RODGERS,M. STEVEN, and SNIEGOWSKI,JEFFRY J. Integration of optoelectronics and MEMS by free-space micro-optics. United States: N. p., 2000. Web. doi:10.2172/756048.
WARREN,MIAL E., SPAHN,OLGA B., SWEATT,WILLIAM C., SHUL,RANDY J., WENDT,JOEL R., VAWTER,GREGORY A., KRYGOWSKI,TOM W., REYES,DAVID NMN, RODGERS,M. STEVEN, & SNIEGOWSKI,JEFFRY J. Integration of optoelectronics and MEMS by free-space micro-optics. United States. doi:10.2172/756048.
WARREN,MIAL E., SPAHN,OLGA B., SWEATT,WILLIAM C., SHUL,RANDY J., WENDT,JOEL R., VAWTER,GREGORY A., KRYGOWSKI,TOM W., REYES,DAVID NMN, RODGERS,M. STEVEN, and SNIEGOWSKI,JEFFRY J. Thu . "Integration of optoelectronics and MEMS by free-space micro-optics". United States. doi:10.2172/756048. https://www.osti.gov/servlets/purl/756048.
@article{osti_756048,
title = {Integration of optoelectronics and MEMS by free-space micro-optics},
author = {WARREN,MIAL E. and SPAHN,OLGA B. and SWEATT,WILLIAM C. and SHUL,RANDY J. and WENDT,JOEL R. and VAWTER,GREGORY A. and KRYGOWSKI,TOM W. and REYES,DAVID NMN and RODGERS,M. STEVEN and SNIEGOWSKI,JEFFRY J.},
abstractNote = {This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shattering of optical sources. The two technologies use dissimilar materials with significant compatibility problems for a common process line. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and through-vias in the substrate. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light. The authors explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. The components can be surface-mounted by flip-chip bonding to the substrate. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate from one device to another and them be directed out of the substrate into free space. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. They report progress on a MEMS-based laser scanner using these concepts.},
doi = {10.2172/756048},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {6}
}