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Title: A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure

Abstract

A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF is caused by different coefficients of thermal expansion (CTEs) of the materials in an electronic package, combined with changes in the ambient temperature. Different CTEs result in cyclical strain in the assembly, and this strain is concentrated almost entirely in the solder because it is the most deformable portion of the package. Since solder alloy is at a significant fraction of its melting point even at room temperature, the cyclical strain enhances mass diffusion and causes dramatic changes in the alloy microstructure over time. As the microstructure changes and becomes coarser, the solder alloy weakens and eventually microcracks nucleate and grow in the joint, leading to component failure. the failure of solder joints is difficult to detect due to the inert nature of the electrical system. If the system is not on for extended periods then failures can not be observed. Therefore it is important to develop an advanced predictive capability which allows scientists and engineers to predict solder degradation and identify reliability problems in aging electronics early.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
754333
Report Number(s):
SAND2000-1055J; 0000035229-000
0000035229-000; TRN: AH200016%%223
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
Journal of Applied Mechanics
Additional Journal Information:
Other Information: Submitted to Journal of Applied Mechanics; PBD: 25 Apr 2000
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; SOLDERED JOINTS; RELIABILITY; FATIGUE; MICROSTRUCTURE; FAILURES; ELECTRONIC EQUIPMENT; PLASTICITY; BRAZING ALLOYS

Citation Formats

CHEN, ZHEN, and FANG, HUEI ELIOT. A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure. United States: N. p., 2000. Web.
CHEN, ZHEN, & FANG, HUEI ELIOT. A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure. United States.
CHEN, ZHEN, and FANG, HUEI ELIOT. 2000. "A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure". United States. https://www.osti.gov/servlets/purl/754333.
@article{osti_754333,
title = {A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure},
author = {CHEN, ZHEN and FANG, HUEI ELIOT},
abstractNote = {A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF is caused by different coefficients of thermal expansion (CTEs) of the materials in an electronic package, combined with changes in the ambient temperature. Different CTEs result in cyclical strain in the assembly, and this strain is concentrated almost entirely in the solder because it is the most deformable portion of the package. Since solder alloy is at a significant fraction of its melting point even at room temperature, the cyclical strain enhances mass diffusion and causes dramatic changes in the alloy microstructure over time. As the microstructure changes and becomes coarser, the solder alloy weakens and eventually microcracks nucleate and grow in the joint, leading to component failure. the failure of solder joints is difficult to detect due to the inert nature of the electrical system. If the system is not on for extended periods then failures can not be observed. Therefore it is important to develop an advanced predictive capability which allows scientists and engineers to predict solder degradation and identify reliability problems in aging electronics early.},
doi = {},
url = {https://www.osti.gov/biblio/754333}, journal = {Journal of Applied Mechanics},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 25 00:00:00 EDT 2000},
month = {Tue Apr 25 00:00:00 EDT 2000}
}