Electrical conductivity study of etched-out plated-through holes in double-sided printed wiring boards

Technical Report · Thu Jan 01 00:00:00 EST 1976

DOI:https://doi.org/10.2172/7366961· OSTI ID:7366961

Setter, R. J.

A proposed method for producing nonplated-through holes in double-sided printed wiring boards has been proved not detrimental to the functioning of the boards. Electrical conductivity measurements of holes which had been drilled, plated through with copper, and subsequently etched out to produce nonplated-through holes indicated negligible conductance in the range from 1 to 6 picomhos 1 to 6 pS. (auth)

• Research Organization: Bendix Corp., Kansas City, MO (United States)
• DOE Contract Number: AT(29-1)-613
• OSTI ID: 7366961
• Report Number(s): BDX-613-1434
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
PRINTED CIRCUITS
FABRICATION
ELECTRIC CONDUCTIVITY
ETCHING
PLATING
DEPOSITION
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
PHYSICAL PROPERTIES
SURFACE COATING
SURFACE FINISHING
420800* - Engineering- Electronic Circuits & Devices- (-1989)