Microchannel heat sink assembly

Patent · Tue Mar 24 00:00:00 EST 1992

OSTI ID:7273538

Bonde, W L; Contolini, R J

The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watertight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures. 13 figs.

• DOE Contract Number: W-7405-ENG-48
• Assignee: Dept. of Energy, Washington, DC (United States)
• Patent Number(s): US 5099311; A
• Application Number: PPN: US 7-642736
• OSTI ID: 7273538
• Resource Relation: Patent File Date: 17 Jan 1991
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
99 GENERAL AND MISCELLANEOUS//MATHEMATICS, COMPUTING, AND INFORMATION SCIENCE
ELECTRONIC EQUIPMENT
COOLING
HEAT SINKS
DESIGN
SUPERCOMPUTERS
COOLING SYSTEMS
COMPUTERS
DIGITAL COMPUTERS
ENERGY SYSTEMS
EQUIPMENT
SINKS
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
990200 - Mathematics & Computers