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Title: Chemical vapor deposition for microelectronics: Principles, technology, and applications

Abstract

This book presents study of chemical vapor deposition (CVD). CVD is an inherently interdisciplinary field. Its understanding requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics and kinetics, as well as homogeneous and heterogenous chemical reactions. The newest developments in this rapidly changing field are described. After the basics of thermal and plasma-enhanced chemical vapor deposition are covered in the first two chapters, the next three chapters deal with the many diverse films used in semiconductor fabrication that can be deposited by this technique. Because of the importance of commercially-viable reactors for film deposition, many well-known and widely-used deposition systems are described. Finally, the physical and chemical nature of these films is analyzed.

Authors:
Publication Date:
OSTI Identifier:
7247367
Alternate Identifier(s):
OSTI ID: 7247367
Resource Type:
Book
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 36 MATERIALS SCIENCE; 42 ENGINEERING; CHEMICAL VAPOR DEPOSITION; FLUID MECHANICS; TECHNOLOGY ASSESSMENT; THIN FILMS; CHEMICAL PROPERTIES; FABRICATION; MICROELECTRONICS; PHYSICAL PROPERTIES; CHEMICAL REACTIONS; REVIEWS; SEMICONDUCTOR DEVICES; THERMODYNAMICS; USES; CHEMICAL COATING; DEPOSITION; DOCUMENT TYPES; FILMS; MECHANICS; SURFACE COATING 656000* -- Condensed Matter Physics; 640301 -- Atomic, Molecular & Chemical Physics-- Beams & their Reactions; 360601 -- Other Materials-- Preparation & Manufacture; 420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)

Citation Formats

Sherman, A. Chemical vapor deposition for microelectronics: Principles, technology, and applications. United States: N. p., 1987. Web.
Sherman, A. Chemical vapor deposition for microelectronics: Principles, technology, and applications. United States.
Sherman, A. Thu . "Chemical vapor deposition for microelectronics: Principles, technology, and applications". United States.
@article{osti_7247367,
title = {Chemical vapor deposition for microelectronics: Principles, technology, and applications},
author = {Sherman, A.},
abstractNote = {This book presents study of chemical vapor deposition (CVD). CVD is an inherently interdisciplinary field. Its understanding requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics and kinetics, as well as homogeneous and heterogenous chemical reactions. The newest developments in this rapidly changing field are described. After the basics of thermal and plasma-enhanced chemical vapor deposition are covered in the first two chapters, the next three chapters deal with the many diverse films used in semiconductor fabrication that can be deposited by this technique. Because of the importance of commercially-viable reactors for film deposition, many well-known and widely-used deposition systems are described. Finally, the physical and chemical nature of these films is analyzed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1987},
month = {1}
}

Book:
Other availability
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