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Title: Native oxide films of In sub 0. 53 Ga sub 0. 47 As formed using plasma anodization

Journal Article · · Journal of the Electrochemical Society; (United States)
DOI:https://doi.org/10.1149/1.2069490· OSTI ID:7237844
;  [1]
  1. Dept. of Electronic and Electrical Engineering, King's College London, Strand, London WC2R 2LS (GB)

This paper reports on DC plasma anodization that has been used to form insulating native oxide films on IN{sub 0.53}Ga{sub 0.47}As epitaxial layers supported on semi-insulting and conducting InP substrates. Anodizations at constant current density have been compared with those which were limited by a preset voltage. Rutherford back scattering showed that the composition was In{sub 0.46}(Ga + As){sub 1.47}O{sub 6.0} for both anodization processes. There was a loss of about 11% In in comparison with the aggregate of the Ga and As fractions. The absolute losses of In and (Ga + As) were 20 and 6%, respectively. The volume increase on oxidation was imperceptible. Auger electron spectroscopy showed that the oxide-semiconductor interface width was less than 40 {Angstrom}. When current limited growth was used, the composition within 200 {Angstrom} of the interface was particularly uniform. Measurements of electrical resistivity, breakdown field, permittivity, and etch rate are reported and point to the usefulness of the plasma native oxide as a device insulator material.

OSTI ID:
7237844
Journal Information:
Journal of the Electrochemical Society; (United States), Vol. 139:6; ISSN 0013-4651
Country of Publication:
United States
Language:
English

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