Method for the thermal characterization, visualization, and integrity evaluation of conducting material samples or complex structures
Patent
·
OSTI ID:7232736
Disclosed is a method for modeling a conducting material sample or structure (herein called a system) as at least two regions which comprise an electrical network of resistances, for measuring electric resistance between at least two selected pairs of external leads attached to the surface of the system, wherein at least one external lead is attached to the surface of each of the regions, and, using basic circuit theory, for translating measured resistances into temperatures or thermophysical properties in corresponding regions of the system. 16 figs.
- DOE Contract Number:
- AC07-76ID01570
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- A; US 5165794
- Application Number:
- PPN: US 7-739376
- OSTI ID:
- 7232736
- Country of Publication:
- United States
- Language:
- English
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