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Title: Reaction of aerosols formed by supercritical fluid expansion

Miscellaneous ·
OSTI ID:7207506

A new process has been developed for generating films and fine particles which have technologically important applications. Supercritical fluids have been used to dissolve, transport, and vaporize or aerosolize precursor compound(s) where the precursors underwent reactions near or at a substrate surface to form films. Metal films of Al, Ag, Cr, Cu, In, Ni, Pd, Y, and Zr have been deposited from metal coordination compounds dissolved in supercritical fluids in which organic ligands or the solvent serve as reducing agents for the metal ions. Metal oxide films of CuO, Al[sub 2]O[sub 3], Cr[sub 2]O[sub 3], and have been deposited on unheated substrates from supercritical N[sub 2]O solutions using a radio frequency plasma in which radicals and ions from the N[sub 2]O serve as oxidizing agents. Silicon dioxide films were deposited from tetraethoxysilane dissolved in supercritical nitrous oxide discharged into the plasma. Silicon dioxide films doped with boron and phosphorous were formed by the addition triethylborate and triethylphosphite to the precursor solution. Mixed metal oxide films of yttrium barium, and copper were deposited without heating the substrate using a nitrous oxide plasma. Superconducting films of YBa[sub 2]Cu[sub 3]O[sub 7] have been prepared by post-deposition oxidation of the metals co-deposited from supercritical pentane.

Research Organization:
Colorado Univ., Boulder, CO (United States)
OSTI ID:
7207506
Resource Relation:
Other Information: Thesis (Ph.D.)
Country of Publication:
United States
Language:
English