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Title: Thermodynamic analysis of the W--F--Si--H and W--F--Si--H--Cl systems

Journal Article · · Journal of Vacuum Science and Technology, B: Microelectronics Processing and Phenomena; (USA)
DOI:https://doi.org/10.1116/1.584834· OSTI ID:7171206
 [1];  [2]
  1. Department of Chemical Engineering, San Jose State University, San Jose, California 95192 (US)
  2. Genus Incorporated, Mountain View, California 94043 (USA)

Chemical vapor deposition of WSi{sub 2} was studied through thermodynamic equilibrium calculations for the W--F--Si--H and W--F--Si--H--Cl systems. The calculations were made with a computer program that minimizes the Gibbs free energy by Langrangian multiplier techniques. The parameter range for these system analyses were: temperature 473 to 1073 K, pressure from 50 to 500 mTorr, and Si/W ratios of 3 to 1000. 21 gas phase species and eight solid species were included in the calculations for the W--F--Si--H system and 39 gas phase species and 15 solid species were considered for the W--F--Si--H--Cl system. At the equilibrium condition, H{sub 2}, SiF{sub 4}, and SiF{sub 2}H{sub 2} are the most prominent gaseous species for the W--F--Si--H system while WSi{sub 2} and Si are formed in the solid phase. For the W--F--Si--H--Cl system, WSi{sub 2} and Si are formed in the solid phase, while H{sub 2}, SiCl{sub 4}, HCl, SiF{sub 4} and SiHCl{sub 3} are the most prominent gas phase species. The SiCl{sub 2} intermediate plays a key role in the surface activated reaction for this system.

OSTI ID:
7171206
Journal Information:
Journal of Vacuum Science and Technology, B: Microelectronics Processing and Phenomena; (USA), Vol. 8:1; ISSN 0734-211X
Country of Publication:
United States
Language:
English