Development of novel fabrication techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

Conference · Mon Aug 01 00:00:00 EDT 1994 · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)

OSTI ID:7154894

Saitoh, Y; Takeuchi, H; Mandai, M ^[1]

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1. and others

Full-size models of a detector unit for a silicon microvertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film (ACF) was examined. The structure using the new type ACF and improved fabrication process provide a sufficient electrical connection and good reliability for the detector unit.

• OSTI ID: 7154894
• Report Number(s): CONF-931051-; CODEN: IETNAE; TRN: 94-023095
• Journal Information: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States), Vol. 41:4Pt1; Conference: NSS-MIC '93: nuclear science symposium and medical imaging conference, San Francisco, CA (United States), 30 Oct - 6 Nov 1993; ISSN 0018-9499
• Country of Publication: United States
• Language: English

Related Subjects

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
43 PARTICLE ACCELERATORS
MESON FACTORIES
SI SEMICONDUCTOR DETECTORS
FABRICATION
INTEGRATED CIRCUITS
PARTICLE TRACKS
STRUCTURAL MODELS
ACCELERATORS
ELECTRONIC CIRCUITS
MEASURING INSTRUMENTS
MICROELECTRONIC CIRCUITS
RADIATION DETECTORS
SEMICONDUCTOR DETECTORS
440104* - Radiation Instrumentation- High Energy Physics Instrumentation
430303 - Particle Accelerators- Experimental Facilities & Equipment