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Title: Method of forming superconductive metal layers on electrically nonconductive supports

Patent ·
OSTI ID:7099171

Form superconductive layer of lead or tin on a support by first applying copper layer and then replacing all or part of copper with tin or lead from alkali solution containing tin or lead ions.

Assignee:
North American Philips Co., Inc.
Patent Number(s):
US 3342631
OSTI ID:
7099171
Resource Relation:
Patent Priority Date: Priority date 21 Dec 1962, Netherlands
Country of Publication:
United States
Language:
English