Modeling the temperature dependence of the thermal conductivity of aluminum nitride

Conference · Sun Jan 01 00:00:00 EST 1989

OSTI ID:7070233

Dinwiddie, R B ^[1]; Onn, D G ^[2]

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1. Oak Ridge National Lab., TN (USA)
2. Delaware Univ., Newark, DE (USA). Dept. of Physics and Astronomy

Data on the thermal conductivity of commercially available aluminum nitride substrates, over the temperature range of 20-500 K, is analyzed using the Klemens-Callaway model. Parameters in this model which include crystallite size and impurity concentration, are determined through a nonlinear least squares fitting routine. The resulting parameters are compared with values obtained from other experimental techniques such as scanning electron microscopy (SEM) and proton induced x-ray emission (PIXE). A graphical method has been developed for the estimation of impurity concentration and crystallite size from low temperature thermal conductivity data. 19 refs., 3 figs., 3 tabs.

• Research Organization: Oak Ridge National Lab., TN (USA)
• Sponsoring Organization: DEU; DOE/CE
• DOE Contract Number: AC05-84OR21400
• OSTI ID: 7070233
• Report Number(s): CONF-8910319-3; ON: DE90009428
• Resource Relation: Conference: 21. international thermal conductivity conference, Lexington, KY (USA), 15-18 Oct 1989
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
36 MATERIALS SCIENCE
MATERIALS
THERMAL CONDUCTIVITY
ALGORITHMS
ALUMINIUM COMPOUNDS
ALUMINIUM NITRIDES
BONDING
COMPUTER GRAPHICS
CONCENTRATION RATIO
CRYSTALS
ELECTRON MICROSCOPY
FORECASTING
GRAIN SIZE
IMPURITIES
MEASURING METHODS
NUMERICAL ANALYSIS
OPTIMIZATION
PERFORMANCE TESTING
PHYSICAL PROPERTIES
POLYCRYSTALS
SCATTERING
SUBSTRATES
TECHNOLOGY ASSESSMENT
THERMAL EXPANSION
CRYSTAL STRUCTURE
EXPANSION
FABRICATION
JOINING
MATHEMATICAL LOGIC
MATHEMATICS
MICROSCOPY
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
SIZE
TESTING
THERMODYNAMIC PROPERTIES
420400* - Engineering- Heat Transfer & Fluid Flow
360104 - Metals & Alloys- Physical Properties