Multiwire conductor having greatly increased interwire resistance and method for making same

Patent · Tue Jan 17 00:00:00 EST 1984

OSTI ID:7061014

Luhman, T; Suenaga, M

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

• Assignee: Dept. of Energy
• Patent Number(s): US 4426550
• Application Number: TRN: 84-013866
• OSTI ID: 7061014
• Resource Relation: Patent File Date: Filed date 15 Mar 1982; Other Information: PAT-APPL-358085
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
SUPERCONDUCTING WIRES
DESIGN
FABRICATION
SUPERCONDUCTIVITY
BRITTLENESS
COOLING
COPPER
COPPER COMPOUNDS
CRACK PROPAGATION
DIFFUSION
FILLERS
HEAT TREATMENTS
INTERMETALLIC COMPOUNDS
MELTING POINTS
SUPERCONDUCTORS
TIN
TIN COMPOUNDS
ALLOYS
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELEMENTS
MECHANICAL PROPERTIES
METALS
PHYSICAL PROPERTIES
THERMODYNAMIC PROPERTIES
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
TRANSITION TEMPERATURE
WIRES
420201* - Engineering- Cryogenic Equipment & Devices