Surface grid technique for noncontact e-beam testing of very large scale integrated package substrate

Journal Article · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)

DOI:https://doi.org/10.1116/1.585394· OSTI ID:7047125

Lee, K L; Schaefer, C; Kern, D P ^[1]

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1. Thomas J. Watson Research Center, New York, NY (United States)

A surface grid assisted charging technique for noncontact e-beam testing of very large scale integrated package substrates has been developed. Successful charging of packages with a variety of combination of conductor/substrate materials (i.e., Au/alumina ceramic, Mo/alumina ceramic, Solder/polyimide, and chromium/polyimide) has been demonstrated using this technique. In this paper, both theoretical and experimental results concerning the role of a surface grid in addressing various testing issues such a package material parameters, charge localization, secondary electron redistribution, local field effect, and the electron detector response characteristic will be discussed.

• OSTI ID: 7047125
• Journal Information: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Vol. 9:4; ISSN 0734-211X
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
INTEGRATED CIRCUITS
ELECTRICAL TESTING
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELECTRON BEAMS
PACKAGING
SUBSTRATES
BEAMS
ELECTRONIC CIRCUITS
LEPTON BEAMS
MATERIALS TESTING
MICROELECTRONIC CIRCUITS
NONDESTRUCTIVE TESTING
PARTICLE BEAMS
PHYSICAL PROPERTIES
TESTING
420500* - Engineering- Materials Testing