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Title: Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

Patent ·
OSTI ID:7005264

Primary diamines are disclosed of the formula shown in a diagram wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzomethane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.

DOE Contract Number:
W-7405-ENG-48
Assignee:
Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 4252936; A
Application Number:
PPN: US 6-005940
OSTI ID:
7005264
Resource Relation:
Patent File Date: 24 Jan 1979
Country of Publication:
United States
Language:
English