Process effects on high voltage electrical assembly performance. Final report
Manufacturing processes and package configurations that affect the operation of some high voltage electrical assemblies have been evaluated. High voltage breakdown, adhesion problems, and encapsulated component and solder joint breakage have been relieved by improvements in residue analysis, cleaning and coating techniques, and stress relief coatings. A quantitative comparison of encapsulated lead stress relief systems has been completed to determine their effect on both component and solder joints during thermal cycling of encapsulated electronic assemblies. Evaluations have been conducted involving printed circuit board substrates with thermal expansion equal in all directions. A qualitative solder joint thermal cycle study was conducted to compare the effects of encapsulant, lead loops, and sleeving on solder joint failure.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 6933983
- Report Number(s):
- BDX-613-1887(Rev.)
- Country of Publication:
- United States
- Language:
- English
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