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Title: Effects of grain strain and strain rate on the flow stress of copper

Technical Report ·
OSTI ID:6896393

A study was performed to determine the effects of grain size and deformation rate on the flow stress of OFE copper. Testing was performed in compression at ambient conditions at quasi-static and high strain rates. Testing at different strain rates allowed the dependence of the Hall-Petch parameters on strain rate to be examined. The effect of various crystallographic textures on mechanical behavior was also examined. Findings of the study are as follows: Decrease in grain size caused an increase in flow stress. The observed dependence of flow stress on grain size was found to be consistent with the Hall-Petch relation. Results of the study suggest that strain rate does not have an influence on the proportional relationship between flow stress and grain size, i.e., the Hall-Petch parameter kepsilon is not strain-rate dependent. Crystallographic texture had no discernible effect on stress-strain response at high strain rates.

Research Organization:
Lawrence Livermore National Lab., CA (USA)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
6896393
Report Number(s):
UCID-21450; ON: DE88016112
Resource Relation:
Other Information: Paper copy only, copy does not permit microfiche production
Country of Publication:
United States
Language:
English