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Title: Crack-like grain-boundary diffusion wedges in thin metal films

Abstract

Constrained grain-boundary diffusion in polycrystalline thin metal films on substrates is studied as a strongly coupled elasticity and grain-boundary diffusion problem in which no sliding and no diffusion are allowed at the film/substrate interface. Surface diffusion and grain-boundary grooving are neglected in the present analysis. The authors show that such a diffusion process leads to the formation of crack-like grain-boundary wedges which cause the normal traction along the grain boundary to decay exponentially with time. A rigorous mathematical analysis is performed to derive and calculate the transient solutions for diffusion along a single grain boundary and along a periodic array of grain boundaries. An approximate closed-form solution is also given as a simple description of constrained grain-boundary diffusion. A most remarkable feature of the solution is that the diffusion wedges induce crack-like singular stress concentrations which could also enhance dislocation plasticity processes in a metal film.

Authors:
; ;  [1];  [2];  [3]
  1. Stanford Univ., CA (United States)
  2. Massachusetts Inst. of Tech., Cambridge, MA (United States). Dept. of Materials Science and Engineering
  3. Max-Planck-Inst. fuer Metallforschung, Stuttgart (Germany)
Publication Date:
Sponsoring Org.:
National Science Foundation, Washington, DC (United States); USDOE, Washington, DC (United States)
OSTI Identifier:
684389
DOE Contract Number:  
FG03-89ER45387
Resource Type:
Journal Article
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 47; Journal Issue: 10; Other Information: PBD: 10 Aug 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; DEFORMATION; METALS; THIN FILMS; STRESSES; GRAIN BOUNDARIES; DIFFUSION; MATHEMATICAL MODELS

Citation Formats

Gao, H., Zhang, L., Nix, W.D., Thompson, C.V., and Arzt, E. Crack-like grain-boundary diffusion wedges in thin metal films. United States: N. p., 1999. Web. doi:10.1016/S1359-6454(99)00178-0.
Gao, H., Zhang, L., Nix, W.D., Thompson, C.V., & Arzt, E. Crack-like grain-boundary diffusion wedges in thin metal films. United States. doi:10.1016/S1359-6454(99)00178-0.
Gao, H., Zhang, L., Nix, W.D., Thompson, C.V., and Arzt, E. Tue . "Crack-like grain-boundary diffusion wedges in thin metal films". United States. doi:10.1016/S1359-6454(99)00178-0.
@article{osti_684389,
title = {Crack-like grain-boundary diffusion wedges in thin metal films},
author = {Gao, H. and Zhang, L. and Nix, W.D. and Thompson, C.V. and Arzt, E.},
abstractNote = {Constrained grain-boundary diffusion in polycrystalline thin metal films on substrates is studied as a strongly coupled elasticity and grain-boundary diffusion problem in which no sliding and no diffusion are allowed at the film/substrate interface. Surface diffusion and grain-boundary grooving are neglected in the present analysis. The authors show that such a diffusion process leads to the formation of crack-like grain-boundary wedges which cause the normal traction along the grain boundary to decay exponentially with time. A rigorous mathematical analysis is performed to derive and calculate the transient solutions for diffusion along a single grain boundary and along a periodic array of grain boundaries. An approximate closed-form solution is also given as a simple description of constrained grain-boundary diffusion. A most remarkable feature of the solution is that the diffusion wedges induce crack-like singular stress concentrations which could also enhance dislocation plasticity processes in a metal film.},
doi = {10.1016/S1359-6454(99)00178-0},
journal = {Acta Materialia},
number = 10,
volume = 47,
place = {United States},
year = {1999},
month = {8}
}