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Title: Thermal evolution of high-purity and boron-doped sub-microcrystalline Ni{sub 3}Al produced by severe plastic deformation

Abstract

The influence of boron on the structural stability of sub-microcrystalline Ni{sub 3}Al intermetallic compounds was investigated by comparing a high-purity material with a boron-doped (0.1 wt%) compound. The nanocrystalline structure was obtained by severe shear deformation under quasi-hydrostatic pressure. Residual electrical resistivity, Vickers microhardness, X-ray diffraction and transmission electron microscopy were used to characterize the material evolution during thermal treatments in the temperature range 293--1,313 K. After severe deformation the materials were disordered, with a small crystallite size of about 20 nm, similar in both materials. During isochronal anneals, the evolution of the microstructure, the long-range ordering and the recovery of the investigated properties took place at higher temperatures in the boron-doped compound, i.e. the thermal stability of the cold-worked structure was higher.

Authors:
; ;  [1]; ; ;  [2];  [3]
  1. Russian Academy of Sciences, Ufa (Russian Federation). Inst. of Metals Superplasticity Problems
  2. CNRS, Vitry-sur-Seine (France)
  3. Ufa State Aviation Univ. (Russian Federation). Inst. of Physics of Advanced Materials
Publication Date:
OSTI Identifier:
684387
Resource Type:
Journal Article
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 47; Journal Issue: 11; Other Information: PBD: 8 Sep 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MICROSTRUCTURE; DEFORMATION; NICKEL ALLOYS; ALUMINIUM ALLOYS; BORON ADDITIONS; INTERMETALLIC COMPOUNDS; HEAT TREATMENTS; ELECTRIC CONDUCTIVITY; MICROHARDNESS; MICROSCOPY

Citation Formats

Korznikov, A.V., Korznikova, G.F., Idrisova, S.R., Dimitrov, O., Dallas, J.P., Faudot, F., and Valiev, R.Z. Thermal evolution of high-purity and boron-doped sub-microcrystalline Ni{sub 3}Al produced by severe plastic deformation. United States: N. p., 1999. Web. doi:10.1016/S1359-6454(99)00172-X.
Korznikov, A.V., Korznikova, G.F., Idrisova, S.R., Dimitrov, O., Dallas, J.P., Faudot, F., & Valiev, R.Z. Thermal evolution of high-purity and boron-doped sub-microcrystalline Ni{sub 3}Al produced by severe plastic deformation. United States. doi:10.1016/S1359-6454(99)00172-X.
Korznikov, A.V., Korznikova, G.F., Idrisova, S.R., Dimitrov, O., Dallas, J.P., Faudot, F., and Valiev, R.Z. Wed . "Thermal evolution of high-purity and boron-doped sub-microcrystalline Ni{sub 3}Al produced by severe plastic deformation". United States. doi:10.1016/S1359-6454(99)00172-X.
@article{osti_684387,
title = {Thermal evolution of high-purity and boron-doped sub-microcrystalline Ni{sub 3}Al produced by severe plastic deformation},
author = {Korznikov, A.V. and Korznikova, G.F. and Idrisova, S.R. and Dimitrov, O. and Dallas, J.P. and Faudot, F. and Valiev, R.Z.},
abstractNote = {The influence of boron on the structural stability of sub-microcrystalline Ni{sub 3}Al intermetallic compounds was investigated by comparing a high-purity material with a boron-doped (0.1 wt%) compound. The nanocrystalline structure was obtained by severe shear deformation under quasi-hydrostatic pressure. Residual electrical resistivity, Vickers microhardness, X-ray diffraction and transmission electron microscopy were used to characterize the material evolution during thermal treatments in the temperature range 293--1,313 K. After severe deformation the materials were disordered, with a small crystallite size of about 20 nm, similar in both materials. During isochronal anneals, the evolution of the microstructure, the long-range ordering and the recovery of the investigated properties took place at higher temperatures in the boron-doped compound, i.e. the thermal stability of the cold-worked structure was higher.},
doi = {10.1016/S1359-6454(99)00172-X},
journal = {Acta Materialia},
number = 11,
volume = 47,
place = {United States},
year = {1999},
month = {9}
}