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Title: Waste Isolation Pilot Plant dry bin-scale integrated systems checkout plan

Abstract

The Integrated Systems Checkout Plan (ISCP) addresses a two-phase approach to ensuring WIPP readiness to support the Dry Bin-Scale CH TRU Waste Test. The first phase includes all those activities necessary to ensure readiness of individual systems and equipment. The second phase is a bin-scale integrated checkout using four mock bins. The ISCP has been developed to provide assurance that operational activities dedicated to supporting the bin-scale tests can be achieved safely. To attain this assurance, a systematic approach will address: development of procedures to control system and equipment start-up and acceptance tests; development of procedures to control operation of systems and equipment, waste receipt, emplacement, operation, test termination, waste retrieval, and post-test shipping; monitoring of systems installation and checkout to ensure systems meet acceptance testing criteria; initial operation of systems to validate procedural controls; training of personnel to perform systems operational activities in accordance with procedural controls; capability of corrective action for abnormal events; and documentation of acceptance testing data and personnel training and qualification requirements. 11 refs., 7 figs., 2 tabs.

Publication Date:
Research Org.:
Westinghouse Electric Corp., Carlsbad, NM (USA). Waste Isolation Div.
Sponsoring Org.:
DOE/DP
OSTI Identifier:
6815856
Report Number(s):
DOE/WIPP-90-002
ON: DE90013697
DOE Contract Number:  
AC04-86AL31950
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ALPHA-BEARING WASTES; CONTACT HANDLING; CONTAINERS; TESTING; EQUIPMENT; BACKFILLING; BENTONITE; BRINES; ENVIRONMENTAL IMPACTS; GETTERS; PILOT PLANTS; RADIOACTIVE WASTE DISPOSAL; RADIOACTIVE WASTE FACILITIES; SALTS; VOLATILE MATTER; WASTE FORMS; WIPP; CLAYS; FUNCTIONAL MODELS; MANAGEMENT; MATERIALS; MATTER; NATIONAL ORGANIZATIONS; NUCLEAR FACILITIES; RADIOACTIVE MATERIALS; RADIOACTIVE WASTES; UNDERGROUND FACILITIES; US DOE; US ORGANIZATIONS; WASTE DISPOSAL; WASTE MANAGEMENT; WASTES; 420203* - Engineering- Handling Equipment & Procedures

Citation Formats

. Waste Isolation Pilot Plant dry bin-scale integrated systems checkout plan. United States: N. p., 1990. Web.
. Waste Isolation Pilot Plant dry bin-scale integrated systems checkout plan. United States.
. 1990. "Waste Isolation Pilot Plant dry bin-scale integrated systems checkout plan". United States.
@article{osti_6815856,
title = {Waste Isolation Pilot Plant dry bin-scale integrated systems checkout plan},
author = {},
abstractNote = {The Integrated Systems Checkout Plan (ISCP) addresses a two-phase approach to ensuring WIPP readiness to support the Dry Bin-Scale CH TRU Waste Test. The first phase includes all those activities necessary to ensure readiness of individual systems and equipment. The second phase is a bin-scale integrated checkout using four mock bins. The ISCP has been developed to provide assurance that operational activities dedicated to supporting the bin-scale tests can be achieved safely. To attain this assurance, a systematic approach will address: development of procedures to control system and equipment start-up and acceptance tests; development of procedures to control operation of systems and equipment, waste receipt, emplacement, operation, test termination, waste retrieval, and post-test shipping; monitoring of systems installation and checkout to ensure systems meet acceptance testing criteria; initial operation of systems to validate procedural controls; training of personnel to perform systems operational activities in accordance with procedural controls; capability of corrective action for abnormal events; and documentation of acceptance testing data and personnel training and qualification requirements. 11 refs., 7 figs., 2 tabs.},
doi = {},
url = {https://www.osti.gov/biblio/6815856}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {3}
}

Technical Report:
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