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Title: Impurity behavior during recrystallization of plastically deformed semiconductors

Journal Article · · Inorg. Mater. (Engl. Transl.); (United States)
OSTI ID:6815006

This paper studies the behavior of a repeatedly deformed doped semiconducting alloy in order to determine the main reason for the change in the properties of strongly deformed material as compared with weakly deformed material. It was assumed that during repeated deformation a corresponding number of recrystallization processes should occur in the alloy, which to one extent or another will change the concentration of the defects in the newly formed grains. For the starting model material the authors selected the alloy Bi/sub 2/Te /SUB 2.4/ SE /SUB 0.6/ doped with 0.4 mass % CdCl/sub 2/, which crystallizes almost completely directly during the deformation process. It is shown that repeated deformation intensifies the phenomenon observed.

Research Organization:
All-Union Sci-Res. Design Construction... Institute
OSTI ID:
6815006
Journal Information:
Inorg. Mater. (Engl. Transl.); (United States), Vol. 22:5
Country of Publication:
United States
Language:
English

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