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Title: Preservation of indium phosphide substrates - The In-Sn-P melt revisited

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2108361· OSTI ID:6803916

Using Auger electron spectroscopy and secondary ion mass spectrometry, the authors have detected very high levels of tin (-- 10/sup 21//cm/sup 3/) on (100) InP substrates preserved at high temperatures (650/sup 0/-700/sup 0/C) with phosphorus vapor supplied by an In-Sn-P solution. Depth profiling through InP epilayers grown on preserved substrates, however, indicates no tin buildup at the epilayer/substrate interface. Surface studies and depth profiling of control samples reveal that the tin accumulated during preservation is restricted to the near-surface region (less than or equal to 10A) and readily dissolves into an In-P melt.

Research Organization:
AT and T Bell Labs., Murray Hill, NJ
OSTI ID:
6803916
Journal Information:
J. Electrochem. Soc.; (United States), Vol. 133:10, Issue 10
Country of Publication:
United States
Language:
English