Thermal diffusivity of diamond/Si composite films measured by an ac calorimetric method. 2: Characterization of deposited diamond layers
- Tsinghua Univ., Beijing (China). Dept. of Engineering Mechanics
- Nagoya Univ. (Japan). Dept. of Applied Physics
Thermal diffusivity of diamond/Si composite films was measured in the direction parallel to the plane of the film by an ac calorimetric method. The effect of two-dimensional heat conduction on the measured results appears to be due to the difference in the thermal diffusivities of the layers. The thermal diffusivity measured by the thermocouple attached on the diamond side was higher than that on the silicon side. This might be due to the two-dimensional effects. As a result, the estimated thermal diffusivity of the diamond layer from the result of composite film detected on the diamond side is higher than that detected on the Si side. This gives rise to an error in the estimated thermal diffusivity of the diamond layer. A criterion for the deviation of the estimated thermal diffusivity is proposed.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 675538
- Report Number(s):
- CONF-9509483-; ISSN 0195-928X; TRN: IM9833%%147
- Journal Information:
- International Journal of Thermophysics, Vol. 18, Issue 2; Conference: 4. Asian thermophysical properties conference, Tokyo (Japan), 5-8 Sep 1995; Other Information: PBD: Mar 1997
- Country of Publication:
- United States
- Language:
- English
Similar Records
Measuring thermal diffusivity of mechanical and optical grades of polycrystalline diamond using an AC laser calorimetry method
Study of thermal diffusivity measurement of CVD diamond