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Title: Characteristics of lift-off fabricated AlGaAs/InGaAs single-strained-quantum-well structures on glass and silicon substrates

Conference ·
OSTI ID:6743656

A technique involving the liftoff of thin (/approx/1 /mu/m) III-V structures grown on GaAs substrates and subsequent bonding to glass or SiO/sub 2/-covered Si substrates has been investigated. AlGaAs/InGaAs/GaAs single-strained-quantum-well structures have been grown by molecular beam epitaxy and characterized before and after lift-off and bonding to foreign substrates. X-ray diffraction measurements were performed to determine the strain state of the films over a wide temperature range after bonding. Low-temperature photoluminescence measurements on 125/angstrom/-well undoped structures show that the narrow linewidths observed in the as-grown samples (/approx/4 MeV) are not broadened by the lift-off and bonding process. Room- and low-temperature dc measurements made on modulation-doped field-effect transistors show that electronic transport properties are not adversely affected by this process. 8 refs., 6 figs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6743656
Report Number(s):
SAND-88-2588C; CONF-8809152-4; ON: DE89001374
Resource Relation:
Conference: International symposium on gallium-arsenide and related compounds, Atlanta, GA, USA, 11 Sep 1988; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English