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Title: Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching

Abstract

Deep-reactive ion etching (DRIE) of silicon, also known as high-aspect-ratio silicon etching (HARSE), is distinguished by fast etch rates ({approximately}3 {micro}m/min), crystal orientation independence, anisotropy, vertical sidewall profiles and CMOS compatibility. By using through-wafer HARSE and stopping on a dielectric film placed on the opposite side of the wafer, freestanding dielectric membranes were produced. Dielectric membrane-based sensors and actuators fabricated in this way include microhotplates, flow sensors, valves and magnetically-actuated flexural plate wave (FPW) devices. Unfortunately, low-stress silicon nitride, a common membrane material, has an appreciable DRI etch rate. To overcome this problem HARSE can be followed by a brief wet chemical etch. This approach has been demonstrated using KOH or HF/Nitric/Acetic etchants, both of which have significantly smaller etch rates on silicon nitride than does DRIE. Composite membranes consisting of silicon dioxide and silicon nitride layers are also under evaluation due to the higher DRIE selectivity to silicon dioxide.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Org.:
USDOE Office of Financial Management and Controller, Washington, DC (United States)
OSTI Identifier:
663236
Report Number(s):
SAND-98-1777C; CONF-980918-
ON: DE98007249; BR: YN0100000; TRN: AHC29818%%68
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Micromachining and microfabrication symposium, Santa Clara, CA (United States), 21-22 Sep 1998; Other Information: PBD: [1998]
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; ETCHING; SILICON; ACTUATORS; FLOWMETERS; FABRICATION; SILICON NITRIDES; SILICON OXIDES; COMPOSITE MATERIALS; MINIATURIZATION

Citation Formats

Manginell, R P, Frye-Mason, G C, Schubert, W K, Shul, R J, and Willison, C G. Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching. United States: N. p., 1998. Web.
Manginell, R P, Frye-Mason, G C, Schubert, W K, Shul, R J, & Willison, C G. Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching. United States.
Manginell, R P, Frye-Mason, G C, Schubert, W K, Shul, R J, and Willison, C G. Sat . "Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching". United States. https://www.osti.gov/servlets/purl/663236.
@article{osti_663236,
title = {Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching},
author = {Manginell, R P and Frye-Mason, G C and Schubert, W K and Shul, R J and Willison, C G},
abstractNote = {Deep-reactive ion etching (DRIE) of silicon, also known as high-aspect-ratio silicon etching (HARSE), is distinguished by fast etch rates ({approximately}3 {micro}m/min), crystal orientation independence, anisotropy, vertical sidewall profiles and CMOS compatibility. By using through-wafer HARSE and stopping on a dielectric film placed on the opposite side of the wafer, freestanding dielectric membranes were produced. Dielectric membrane-based sensors and actuators fabricated in this way include microhotplates, flow sensors, valves and magnetically-actuated flexural plate wave (FPW) devices. Unfortunately, low-stress silicon nitride, a common membrane material, has an appreciable DRI etch rate. To overcome this problem HARSE can be followed by a brief wet chemical etch. This approach has been demonstrated using KOH or HF/Nitric/Acetic etchants, both of which have significantly smaller etch rates on silicon nitride than does DRIE. Composite membranes consisting of silicon dioxide and silicon nitride layers are also under evaluation due to the higher DRIE selectivity to silicon dioxide.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {8}
}

Conference:
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