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Title: The microchannel heatsink with liquid nitrogen cooling

Abstract

Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm[sup 2]. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 [degree]K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm[sup 2] heat load, a thermal resistances of 0.052 cm[sup 2*0]C/W for a 9:1 aspect ratio heatsink was measured.

Authors:
;
Publication Date:
Research Org.:
Lawrence Livermore National Lab., CA (United States)
Sponsoring Org.:
USDOE; USDOE, Washington, DC (United States)
OSTI Identifier:
6604870
Report Number(s):
UCRL-JC-109267; CONF-920792-49
ON: DE93009258
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Conference
Resource Relation:
Conference: Society of Photo-Optical Instrumentation Engineers (SPIE) international symposium on optical applied science and engineering, San Diego, CA (United States), 19-24 Jul 1992
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; HEAT SINKS; COOLING; COOLANTS; ELECTRONIC EQUIPMENT; LIQUEFIED GASES; NITROGEN; SUBCOOLED BOILING; THERMAL ANALYSIS; BOILING; ELEMENTS; EQUIPMENT; NONMETALS; PHASE TRANSFORMATIONS; SINKS; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Riddle, R A, and Bernhardt, A F. The microchannel heatsink with liquid nitrogen cooling. United States: N. p., 1992. Web.
Riddle, R A, & Bernhardt, A F. The microchannel heatsink with liquid nitrogen cooling. United States.
Riddle, R A, and Bernhardt, A F. 1992. "The microchannel heatsink with liquid nitrogen cooling". United States.
@article{osti_6604870,
title = {The microchannel heatsink with liquid nitrogen cooling},
author = {Riddle, R A and Bernhardt, A F},
abstractNote = {Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm[sup 2]. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 [degree]K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm[sup 2] heat load, a thermal resistances of 0.052 cm[sup 2*0]C/W for a 9:1 aspect ratio heatsink was measured.},
doi = {},
url = {https://www.osti.gov/biblio/6604870}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 09 00:00:00 EDT 1992},
month = {Tue Jun 09 00:00:00 EDT 1992}
}

Conference:
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