The microchannel heatsink with liquid nitrogen cooling
Conference
·
OSTI ID:6604870
Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm[sup 2]. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 [degree]K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm[sup 2] heat load, a thermal resistances of 0.052 cm[sup 2*0]C/W for a 9:1 aspect ratio heatsink was measured.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 6604870
- Report Number(s):
- UCRL-JC-109267; CONF-920792-49; ON: DE93009258
- Resource Relation:
- Conference: Society of Photo-Optical Instrumentation Engineers (SPIE) international symposium on optical applied science and engineering, San Diego, CA (United States), 19-24 Jul 1992
- Country of Publication:
- United States
- Language:
- English
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