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Title: Copper-boron carbide composite particle and method for its production

Patent ·
OSTI ID:6546662

A process is described for manufacturing radiation shield structures of the type consisting of neutron absorbing boron carbide particles embedded in a copper matrix. The material comprises a multiplicity of particles comprising a core of boron carbide, a film of electroless copper bonded to the carbide, and a relatively thick electrodeposited copper layer bonded to the film. The particles are then consolidated to produce shield structures by hot rolling or hot pressing, with or without sintering.

Assignee:
Kennecott Corp
Patent Number(s):
US 4227928
Application Number:
TRN: 81-007323
OSTI ID:
6546662
Resource Relation:
Patent File Date: Filed date 1 May 1978
Country of Publication:
United States
Language:
English