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Title: Method for conducting electroless metal-plating processes

Patent ·
OSTI ID:6382669

An improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath is described. A problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank is solved. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

Assignee:
Dept. of Energy
Patent Number(s):
US 4125642
OSTI ID:
6382669
Resource Relation:
Patent File Date: Filed date 25 Aug 1977; Other Information: PAT-APPL-827,658
Country of Publication:
United States
Language:
English