Diffusion-induced grain-boundary migration in Au/Cu and Au/Ag thin films
Diffusion induced grain boundary migration (DIGM) was studied by transmission electron microscopy and scanning transmission electron microscopy in the gold-rich layer of thin film Au/Cu and Au/Ag diffusion couples posessing grain boundary structures of controlled geometry. When either copper or silver was diffused along the boundaries in the gold-rich layer at temperatures where lattice diffusion was essentially frozen out, the boundaries were induced to migrate leaving alloyed zones behind in their wakes. The structures and compositions of the alloyed zones and the kinetics of the migration under various conditions were studied in detail in a large number of (111) and (001) tilt boundaries in Au/Cu couples and (111) tilt boundaries in Au/Ag couples. The phenomenon was also studied more indirectly by Auger sputter depth profiling ar random boudaries in Au/Ag couples.
- Research Organization:
- Xerox Palo Alto Research Center, CA (USA); Massachusetts Inst. of Tech., Cambridge (USA). Dept. of Materials Science and Engineering
- DOE Contract Number:
- AS02-78ER05002
- OSTI ID:
- 6367369
- Report Number(s):
- DOE/ER/05002-T4; COO-5002-21; ON: DE81027225
- Resource Relation:
- Other Information: Portions of document are illegible
- Country of Publication:
- United States
- Language:
- English
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