Sputter deposition of aluminum and other alloys at cryogenic temperatures
Structures of thin films deposited at ambient temperatures are similar to those of the bulk material whereas at lower temperatures films have significantly reduced grain size and may become amorphouslike. A two-stage cryorefrigerator was installed in a sputtering system to allow thin films of aluminum and aluminum--copper alloy to be deposited onto substrates cooled to cryogenic temperatures less than 30 K. Gases used for sputtering were argon, neon, and helium at pressures ranging from 0.40 to 2.0 Pa. A standard planar magnetron cathode was used. Vapor pressure--temperature data for gases show that argon will not cryocondense on substrate surfaces at temperatures greater than 40 K and neon will not cryocondense at temperatures above 11 K. Helium is considered for sputtering at substrate temperatures below 11 K. The purpose of this work is to determine the deposition rates using argon, neon, and helium and microstructure changes occurring when thin films are deposited onto cryogenically cooled substrates. Deposition rates are determined using surface profilometry and microstructure was determined by transmission electron microscopy.
- Research Organization:
- XYTORR Corporation, Hilliard, Ohio 43026
- OSTI ID:
- 6317819
- Journal Information:
- J. Vac. Sci. Technol., A; (United States), Vol. 7:3
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM
ENERGY BEAM DEPOSITION
ALUMINIUM BASE ALLOYS
CARBON
COATINGS
COPPER ALLOYS
GLASS
CRYOGENICS
EXPERIMENTAL DATA
LOW TEMPERATURE
MICROSTRUCTURE
SPUTTERING
SUBSTRATES
THIN FILMS
TRANSMISSION ELECTRON MICROSCOPY
VERY LOW TEMPERATURE
ALLOYS
ALUMINIUM ALLOYS
CRYSTAL STRUCTURE
DATA
DEPOSITION
ELECTRON MICROSCOPY
ELEMENTS
FILMS
INFORMATION
METALS
MICROSCOPY
NONMETALS
NUMERICAL DATA
SURFACE COATING
656003* - Condensed Matter Physics- Interactions between Beams & Condensed Matter- (1987-)