skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet. [polyimide]

Abstract

An atmospheric-pressure plasma jet has been used to etch polyimide films at 1.0[endash]8.0[plus minus]0.2 hthinsp;[mu]m/min at 760 Torr and between 50 and 250 hthinsp;[degree]C. The plasma was produced by flowing helium and oxygen between two concentric electrodes, with the inner one coupled to 13.56 MHz rf power and the outer one grounded. The etch rate increased with the O[sub 2] partial pressure, the rf power and the substrate temperature. The apparent activation energy for etching was 0.16 eV. Langmuir-probe measurements revealed that the ion densities were between 1[times]10[sup 10] and 1[times]10[sup 11] hthinsp;cm[sup [minus]3], 5 mm from the end of the powered electrode. Biasing the substrate had no effect on the rate. Ozone, singlet sigma metastable oxygen (b hthinsp;[sup 1][Sigma][sub g][sup +]), and singlet delta metastable oxygen (a hthinsp;[sup 1][Delta][sub g]) were detected in the plasma by emission spectroscopy. More ozone was produced in the effluent through the recombination of O atoms with O[sub 2]. Based on the production rate of O[sub 3], the concentration of O atoms 6 mm from the powered electrode was estimated to be [approximately]7[times]10[sup 14] hthinsp;cm[sup [minus]3] at 6.6 Torr O[sub 2] and 200 W power. It is proposed that O atoms are the principalmore » reactive species involved in etching polyimide. [copyright] [ital 1999 American Vacuum Society.]« less

Authors:
; ; ;  [1]; ; ;  [2];  [1]
  1. (Chemical Engineering Department, University of California, Los Angeles, Los Angeles, California 90095 (United States))
  2. (Plasma Physics, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States))
Publication Date:
OSTI Identifier:
6294170
Alternate Identifier(s):
OSTI ID: 6294170
Resource Type:
Journal Article
Journal Name:
Journal of Vacuum Science and Technology, A
Additional Journal Information:
Journal Volume: 17:5; Journal ID: ISSN 0734-2101
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY; 37 INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; EMISSION SPECTRA; ETCHING; ION DENSITY; MICROELECTRONICS; OXYGEN; OZONE; PLASMA DENSITY; PLASMA JETS; POLYMERS; ELEMENTS; NONMETALS; SPECTRA; SURFACE FINISHING 700300* -- Plasma Physics & Fusion Research-- (1992-); 400201 -- Chemical & Physicochemical Properties

Citation Formats

Jeong, J.Y., Babayan, S.E., Schuetze, A., Tu, V.J., Park, J., Henins, I., Selwyn, G.S., and Hicks, R.F. Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet. [polyimide]. United States: N. p., 1999. Web. doi:10.1116/1.581999.
Jeong, J.Y., Babayan, S.E., Schuetze, A., Tu, V.J., Park, J., Henins, I., Selwyn, G.S., & Hicks, R.F. Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet. [polyimide]. United States. doi:10.1116/1.581999.
Jeong, J.Y., Babayan, S.E., Schuetze, A., Tu, V.J., Park, J., Henins, I., Selwyn, G.S., and Hicks, R.F. Wed . "Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet. [polyimide]". United States. doi:10.1116/1.581999.
@article{osti_6294170,
title = {Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet. [polyimide]},
author = {Jeong, J.Y. and Babayan, S.E. and Schuetze, A. and Tu, V.J. and Park, J. and Henins, I. and Selwyn, G.S. and Hicks, R.F.},
abstractNote = {An atmospheric-pressure plasma jet has been used to etch polyimide films at 1.0[endash]8.0[plus minus]0.2 hthinsp;[mu]m/min at 760 Torr and between 50 and 250 hthinsp;[degree]C. The plasma was produced by flowing helium and oxygen between two concentric electrodes, with the inner one coupled to 13.56 MHz rf power and the outer one grounded. The etch rate increased with the O[sub 2] partial pressure, the rf power and the substrate temperature. The apparent activation energy for etching was 0.16 eV. Langmuir-probe measurements revealed that the ion densities were between 1[times]10[sup 10] and 1[times]10[sup 11] hthinsp;cm[sup [minus]3], 5 mm from the end of the powered electrode. Biasing the substrate had no effect on the rate. Ozone, singlet sigma metastable oxygen (b hthinsp;[sup 1][Sigma][sub g][sup +]), and singlet delta metastable oxygen (a hthinsp;[sup 1][Delta][sub g]) were detected in the plasma by emission spectroscopy. More ozone was produced in the effluent through the recombination of O atoms with O[sub 2]. Based on the production rate of O[sub 3], the concentration of O atoms 6 mm from the powered electrode was estimated to be [approximately]7[times]10[sup 14] hthinsp;cm[sup [minus]3] at 6.6 Torr O[sub 2] and 200 W power. It is proposed that O atoms are the principal reactive species involved in etching polyimide. [copyright] [ital 1999 American Vacuum Society.]},
doi = {10.1116/1.581999},
journal = {Journal of Vacuum Science and Technology, A},
issn = {0734-2101},
number = ,
volume = 17:5,
place = {United States},
year = {1999},
month = {9}
}