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Title: A method for encapsulating high voltage power transformers

Abstract

Voltage breakdowns become a major concern in reducing the size of high-voltage power converter transformers. Even the smallest of voids can provide a path for corona discharge which can cause a dielectric breakdown leading to a transformer failure. A method of encapsulating small high voltage transformers has been developed. The method virtually eliminates voids in the impregnation material, provides an exceptional dielectric between windings and provides a mechanically rugged package. The encapsulation material is a CTBN modified mica filled epoxy. The method requires heat/vacuum to impregnate the coil and heat/pressure to cure the encapsulant. The transformer package utilizes a Diallyl Phthalate (DAP) contact assembly in which a coated core/coil assembly is mounted and soldered. This assembly is then loaded into an RTV mold and the encapsulation process begins.

Authors:
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Org.:
DOE/DP
OSTI Identifier:
6176956
Report Number(s):
SAND-90-2435C; CONF-9103102-2
ON: DE91006644
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Conference
Resource Relation:
Conference: 11. capacitor and resistor technology symposium (CARTS), Las Vegas, NV (USA), 4-7 Mar 1991
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; TRANSFORMERS; ENCAPSULATION; BREAKDOWN; ELECTRICAL INSULATION; EPOXIDES; MICA; STRESS ANALYSIS; ELECTRICAL EQUIPMENT; EQUIPMENT; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Sanchez, R O. A method for encapsulating high voltage power transformers. United States: N. p., 1990. Web.
Sanchez, R O. A method for encapsulating high voltage power transformers. United States.
Sanchez, R O. Mon . "A method for encapsulating high voltage power transformers". United States. https://www.osti.gov/servlets/purl/6176956.
@article{osti_6176956,
title = {A method for encapsulating high voltage power transformers},
author = {Sanchez, R O},
abstractNote = {Voltage breakdowns become a major concern in reducing the size of high-voltage power converter transformers. Even the smallest of voids can provide a path for corona discharge which can cause a dielectric breakdown leading to a transformer failure. A method of encapsulating small high voltage transformers has been developed. The method virtually eliminates voids in the impregnation material, provides an exceptional dielectric between windings and provides a mechanically rugged package. The encapsulation material is a CTBN modified mica filled epoxy. The method requires heat/vacuum to impregnate the coil and heat/pressure to cure the encapsulant. The transformer package utilizes a Diallyl Phthalate (DAP) contact assembly in which a coated core/coil assembly is mounted and soldered. This assembly is then loaded into an RTV mold and the encapsulation process begins.},
doi = {},
url = {https://www.osti.gov/biblio/6176956}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {1}
}

Conference:
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