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Title: Stress relief of ceramic components in high voltage assemblies. Final report

Abstract

Two types of ceramic packages were evaluated to determine the effectiveness of encapsulating the ceramic components in beta eucryptite filled epoxy. The requirements (no high voltage breakdown, no ceramic cracking, and no encapsulant cracking) were met by the spark gap assembly, but the sprytron assembly had cracking in the encapsulant after thermal cycling. The encapsulation of the ceramic component in beta eucryptite filled epoxy with a stress decoupling material selectively applied in the stress concentrated areas were used to prevent cracking in the sprytron encapsulant. This method is proposed as the standard encapsulation process for high voltage ceramic components.

Authors:
Publication Date:
Research Org.:
Bendix Corp., Kansas City, MO (USA)
OSTI Identifier:
6152549
Report Number(s):
BDX-613-2105(Rev.)
TRN: 79-009172
DOE Contract Number:  
EY-76-C-04-0613
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALUMINIUM OXIDES; ENCAPSULATION; STRESS ANALYSIS; ELECTRICAL EQUIPMENT; EPOXIDES; SURFACE COATING; TESTING; THERMAL EXPANSION; ALUMINIUM COMPOUNDS; CHALCOGENIDES; DEPOSITION; EQUIPMENT; EXPANSION; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; OXIDES; OXYGEN COMPOUNDS; 360201* - Ceramics, Cermets, & Refractories- Preparation & Fabrication

Citation Formats

Heinen, R.J. Stress relief of ceramic components in high voltage assemblies. Final report. United States: N. p., 1979. Web. doi:10.2172/6152549.
Heinen, R.J. Stress relief of ceramic components in high voltage assemblies. Final report. United States. doi:10.2172/6152549.
Heinen, R.J. Thu . "Stress relief of ceramic components in high voltage assemblies. Final report". United States. doi:10.2172/6152549. https://www.osti.gov/servlets/purl/6152549.
@article{osti_6152549,
title = {Stress relief of ceramic components in high voltage assemblies. Final report},
author = {Heinen, R.J.},
abstractNote = {Two types of ceramic packages were evaluated to determine the effectiveness of encapsulating the ceramic components in beta eucryptite filled epoxy. The requirements (no high voltage breakdown, no ceramic cracking, and no encapsulant cracking) were met by the spark gap assembly, but the sprytron assembly had cracking in the encapsulant after thermal cycling. The encapsulation of the ceramic component in beta eucryptite filled epoxy with a stress decoupling material selectively applied in the stress concentrated areas were used to prevent cracking in the sprytron encapsulant. This method is proposed as the standard encapsulation process for high voltage ceramic components.},
doi = {10.2172/6152549},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1979},
month = {2}
}