Stress relief of ceramic components in high voltage assemblies. Final report

Technical Report · Thu Feb 01 00:00:00 EST 1979

DOI:https://doi.org/10.2172/6152549· OSTI ID:6152549

Heinen, R J

Two types of ceramic packages were evaluated to determine the effectiveness of encapsulating the ceramic components in beta eucryptite filled epoxy. The requirements (no high voltage breakdown, no ceramic cracking, and no encapsulant cracking) were met by the spark gap assembly, but the sprytron assembly had cracking in the encapsulant after thermal cycling. The encapsulation of the ceramic component in beta eucryptite filled epoxy with a stress decoupling material selectively applied in the stress concentrated areas were used to prevent cracking in the sprytron encapsulant. This method is proposed as the standard encapsulation process for high voltage ceramic components.

• Research Organization: Bendix Corp., Kansas City, MO (United States)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 6152549
• Report Number(s): BDX-613-2105(Rev.); TRN: 79-009172
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM OXIDES
ENCAPSULATION
STRESS ANALYSIS
ELECTRICAL EQUIPMENT
EPOXIDES
SURFACE COATING
TESTING
THERMAL EXPANSION
ALUMINIUM COMPOUNDS
CHALCOGENIDES
DEPOSITION
EQUIPMENT
EXPANSION
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXIDES
OXYGEN COMPOUNDS
360201* - Ceramics
Cermets
& Refractories- Preparation & Fabrication